Apple has been using TSMC’s chipsets to power its devices for years, and now the tech giant is reportedly planning to build its new 5G model on TSMC’s 3nm process as well. According to Gizmochina, Apple has ordered chips that power its PCs and cellular devices from the world’s largest contract chipmaker. TSMC’s latest advancement in semiconductor manufacturing allows it to create chips on a 3nm process node. Chips made using this process are more powerful and energy-efficient as the processor node size decreases.
Apple is likely to be responsible for a significant portion of TSMC’s 3nm process capacity in 2023 for the next generation of chips. One of the orders could be for an internal 5G modem that is made using the latest semiconductor technology from TSMC. The same process is expected to power the next generation A and M series processors.
According to Commercial Times, supply chain sources have disclosed that the risk production of Apple’s 5G modem will begin in the second half of this year. Risk production is essentially the stage where the chip is being built and any issues are being resolved to improve the output. Following this phase, volume production starts, where wafer output usually increases slowly in the first half of next year.
In other words, it appears that iPhone makers will have to depend on Qualcomm Snapdragon 5G modems for at least this year. With Apple relying on TSMC for the latest semiconductor technology, the future seems bright for the company’s devices with faster and efficient chips in the making.
